| Quantity: | |
|---|---|
ZMPC Immersion Cooling Dielectric Fluid
ZMPC
High-Performance Dielectric Cooling Fluid for AI, HPC and Direct-to-Chip-Free Immersion Cooling Systems
ZMPC Immersion Cooling Dielectric Fluid is a high-performance dielectric cooling fluid developed for direct-contact immersion cooling systems in modern data centers. Formulated with a refined hydrocarbon base fluid and a dedicated performance additive package, it is designed to provide a combination of high electrical insulation, efficient heat transfer, excellent low-temperature fluidity and long-term operational stability.
As data center power density continues to increase with AI servers, GPU computing and high-performance computing (HPC), conventional air cooling can face increasing challenges in heat removal and energy efficiency. Immersion cooling provides an alternative thermal management approach by directly contacting electronic components with a non-conductive cooling fluid.
ZMPC Immersion Cooling Dielectric Fluid is designed for data center immersion cooling, high-density server cooling and advanced thermal management systems, helping operators improve cooling efficiency and reduce overall cooling energy consumption.
Optimized fluid flow characteristics and thermal properties enable efficient heat removal from high-power electronic components. The fluid can circulate around servers and other heat-generating components to support continuous thermal management in high-density computing environments.
The dielectric cooling fluid is designed to maintain high electrical insulation performance during long-term operation, helping protect energized electronic components during direct-contact immersion cooling.
The formulation is designed for compatibility with commonly used electronic components and data center equipment. Its controlled composition helps minimize unwanted deposits, varnish-like films and oil residues on immersed components.
Component compatibility should always be verified under the customer's actual operating conditions and with specific equipment/material combinations.
A dedicated additive package helps maintain fluid performance throughout extended operating periods. Good chemical stability supports continuous operation and helps reduce the need for frequent fluid replacement or system maintenance.
Excellent low-temperature flow characteristics support reliable circulation and fluid handling across a wide range of operating environments, making the fluid suitable for different data center climates and cooling system configurations.
Designed for direct-contact immersion cooling systems where servers and electronic components are submerged in dielectric cooling fluid.
Typical applications include:
Data center immersion cooling
High-density server cooling
AI server cooling
GPU server thermal management
HPC data center cooling
Edge data center cooling
High-performance computing infrastructure
AI training and inference workloads can generate significantly higher heat densities than conventional computing applications. Immersion cooling can provide an efficient thermal management approach for GPU-intensive computing environments.
ZMPC dielectric cooling fluid can be considered for AI data center cooling fluid, GPU immersion cooling fluid and high-density computing thermal management applications.
For data centers operating high-power servers in space-constrained environments, direct-contact liquid cooling can provide an alternative to conventional air-based thermal management.
The fluid is suitable for system designs requiring:
High heat removal efficiency
High electrical insulation
Continuous fluid circulation
Stable long-term operation
High-density server deployment
Compared with conventional air cooling, immersion cooling places the cooling medium directly around heat-generating electronic components, allowing heat to be transferred more efficiently through the circulating fluid.
A properly formulated dielectric cooling fluid should provide a balanced combination of:
Electrical insulation + Heat transfer + Flowability + Material compatibility + Chemical stability
ZMPC Immersion Cooling Dielectric Fluid is developed around these requirements to provide a practical data center liquid cooling solution for high-density computing environments.
Application | Cooling Requirement |
|---|---|
AI Data Centers | High-density GPU thermal management |
HPC Data Centers | Continuous high-load cooling |
Cloud Data Centers | Energy-efficient server cooling |
Edge Data Centers | Compact thermal management |
GPU Computing | High heat-flux cooling |
High-Density Servers | Direct-contact immersion cooling |
IDC Facilities | Long-term liquid cooling operation |
ZMPC Immersion Cooling Dielectric Fluid is suitable for customers searching for:
Immersion cooling fluid supplier
Data center cooling fluid manufacturer
Dielectric cooling fluid supplier
Immersion cooling liquid supplier
Data center dielectric fluid
Single-phase immersion cooling fluid
Server immersion cooling fluid
AI data center cooling fluid
GPU immersion cooling fluid
HPC cooling fluid
Data center liquid cooling solution
Hydrocarbon dielectric cooling fluid
High-performance immersion cooling fluid
Dielectric fluid for data centers
Immersion cooling fluid for AI servers
For international B2B customers, the product can be positioned around high-intent searches such as:
high performance immersion cooling fluid for data centers,
dielectric fluid for GPU immersion cooling,
cooling fluid for AI data center servers,
single-phase immersion cooling fluid supplier,
dielectric cooling fluid for high-density servers,
hydrocarbon immersion cooling fluid for HPC,
data center liquid cooling fluid manufacturer,
immersion cooling fluid for high-power computing,
non-conductive cooling fluid for electronic components,
energy-efficient data center cooling fluid.
The technical values provided for this product are representative typical values and should not be interpreted as guaranteed specifications.
Actual product performance and measured values may vary between batches. Batch-specific COA and technical documentation are available upon request.
For new immersion cooling system designs, customers should conduct compatibility, thermal performance, electrical insulation and long-term stability testing using the actual equipment, materials and operating conditions.
Immersion cooling dielectric fluid is a non-conductive cooling medium designed to directly contact electronic equipment in immersion cooling systems. It transfers heat away from servers and other high-power components while providing electrical insulation.
Immersion cooling is primarily used for high-density computing environments such as AI data centers, GPU servers, HPC infrastructure and high-performance computing facilities, where conventional air cooling may become less efficient.
Yes. The product is specifically positioned for high-density data center thermal management, including AI servers, GPU computing and HPC applications, subject to system-level compatibility and performance validation.
Air cooling removes heat through airflow and heat sinks, while immersion cooling directly surrounds heat-generating components with a dielectric liquid. Direct-contact liquid cooling can provide more efficient heat transfer for high-density computing applications.
The product is designed for direct-contact immersion cooling applications. Final suitability for a specific single-phase immersion cooling system should be confirmed through thermal, electrical and material compatibility testing.
ZMPC can provide product technical documentation and batch-specific COA information. Customers are recommended to provide their server configuration, cooling system design, operating temperature, target heat load and material compatibility requirements for technical evaluation.
ZMPC Immersion Cooling Dielectric Fluid — a high-performance liquid cooling solution for AI, GPU and high-density data center thermal management.
Core Value:
Efficient Heat Transfer · Reliable Electrical Insulation · Material Compatibility · Long-Term Stability · Low-Temperature Flowability
Target Customers:
Data center operators · AI infrastructure companies · HPC facilities · Immersion cooling system integrators · Server manufacturers · Liquid cooling technology companies · Data center engineering contractors · Cooling fluid distributors
